32 points | by pseudolus 6 hours ago ago
3 comments
Chip stacking today is limited by thermal management. Can't stack multiple high TDP (e.g. logic) chips together, can only do one + low power chips (e.g. memory). Wonder if this is something DARPA is trying to solve here.
Skywater Technology offers similar services as well. Competition is good but does the US risk funding too many subscale entities?
https://www.skywatertechnology.com/heterogeneous-integration...
The US will fund as many people who will develop this tech as need be. The national champion approach produces a too big to fail lazy company.
Chip stacking today is limited by thermal management. Can't stack multiple high TDP (e.g. logic) chips together, can only do one + low power chips (e.g. memory). Wonder if this is something DARPA is trying to solve here.
Skywater Technology offers similar services as well. Competition is good but does the US risk funding too many subscale entities?
https://www.skywatertechnology.com/heterogeneous-integration...
The US will fund as many people who will develop this tech as need be. The national champion approach produces a too big to fail lazy company.